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INTEGRATED CIRCUITS
DATA SHEET
TDA1554Q 4 x 11 W single-ended or 2 x 22 W power amplifier
Product specification File under Integrated Circuits, IC01 May 1992
Philips Semiconductors
Product specification
4 x 11 W single-ended or 2 x 22 W power amplifier
GENERAL DESCRIPTION
TDA1554Q
The TDA1554Q is an integrated class-B output amplifier in a 17-lead single-in-line (SIL) plastic power package. The circuit contains 4 x 11 W single-ended or 2 x 22 W bridge amplifiers. The device is primarily developed for car radio applications. Features * Requires very few external components * Flexibility in use - Quad single-ended or stereo BTL * High output power * Low offset voltage at outputs (important for BTL) * Fixed gain * Good ripple rejection * Mute/stand-by switch * Load dump protection * AC and DC short-circuit-safe to ground and VP QUICK REFERENCE DATA PARAMETER Supply voltage range operating Repetitive peak output current Total quiescent current Stand-by current Stereo BTL application Output power Supply voltage ripple rejection Noise output voltage (RMS value) Input impedance DC output offset voltage Quad single-ended application Output power THD = 10% RL = 4 RL = 2 Supply voltage ripple rejection Noise output voltage (RMS value) Input impedance RS = 0 Vno(rms) |ZI| - 50 50 60 - 75 V k Po Po RR - - 48 6 11 - - - - W W dB RS = 0 Vno(rms) |ZI| |Vo| - 25 - 70 30 - - 38 100 V k mV RL = 4 ; THD = 10% Po RR 20 48 22 - - - W dB VP IORM Itot Isb 6.0 - - - 14.4 - 80 0.1 18.0 4 160 100 V A mA A CONDITIONS SYMBOL MIN. TYP. MAX. UNIT * Thermally protected * Reverse polarity safe * Capability to handle high energy on outputs (VP = 0 V) * Protected against electrostatic discharge * No switch-on/switch-off plop * Low thermal resistance * Identical inputs (inverting and non-inverting) * Flexible leads.
PACKAGE OUTLINE 17-lead SIL-bent-to-DIL; plastic power (SOT243R); SOT243-1; 1996 July 23.
May 1992
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Philips Semiconductors
Product specification
4 x 11 W single-ended or 2 x 22 W power amplifier
TDA1554Q
Fig.1 Block diagram.
May 1992
3
Philips Semiconductors
Product specification
4 x 11 W single-ended or 2 x 22 W power amplifier
PINNING 1 2 3 4 5 6 7 8 NINV1 INV1 GND RR VP1 OUT1 GND1 OUT2 non-inverting input 1 inverting input 1 ground (signal) supply voltage ripple rejection positive supply voltage 1 output 1 power ground 1 (substrate) output 2 9 10 11 12 13 14 15 16 17 FUNCTIONAL DESCRIPTION n.c. OUT3 GND2 OUT4 VP2 M/SS n.c. INV2 NINV2 not connected output 3 power ground 2 (substrate) output 4 positive supply voltage 2 mute/stand-by switch not connected inverting input 2 non-inverting input 2
TDA1554Q
The TDA1554Q contains four identical amplifiers with differential input stages (two inverting and two non-inverting) and can be used for single-ended or bridge applications. The gain of each amplifier is fixed at 20 dB (26 dB in BTL). A special feature of this device is: Mute/stand-by switch * low stand-by current (< 100 A) * low mute/stand-by switching current (low cost supply switch) * mute facility RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage operating non-operating load dump protected Non-repetitive peak output current Repetitive peak output current Storage temperature range Junction temperature AC and DC short-circuit-safe voltage Energy handling capability at outputs Reverse polarity Total power dissipation see Fig.2 VP = 0 V VPR Ptot during 50 ms; tr 2.5 ms VP IOSM IORM Tstg Tj VPSC - - - -55 - - - - - 45 6 4 + 150 150 18 200 6 60 V A A C C V mJ V W VP VP - - 18 30 V V CONDITIONS SYMBOL MIN. MAX. UNIT
May 1992
4
Philips Semiconductors
Product specification
4 x 11 W single-ended or 2 x 22 W power amplifier
TDA1554Q
Fig.2 Power derating curve.
DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; measurements taken using Fig.4; unless otherwise specified PARAMETER Supply Supply voltage range Total quiescent current DC output voltage DC output offset voltage Mute/stand-by switch Switch-on voltage level Mute condition Output signal in mute position DC output offset voltage (between pins 6 to 8 and 10 to 12) Stand-by condition DC current in stand-by condition Switch-on current May 1992 5 Isb Isw - - - 12 100 40 A A |VO| Vsb - 0 - - 100 2 mV V VI = 1 V (max); f = 1 kHz VO - - 2 mV VON Vmute 8.5 3.3 - - - 6.4 V V note 2 note 1 VP Itot VO |VO| 6.0 - - - 14.4 80 6.9 - 18.0 160 - 100 V mA V mV CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Philips Semiconductors
Product specification
4 x 11 W single-ended or 2 x 22 W power amplifier
TDA1554Q
AC CHARACTERISTICS VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; measurements taken using Fig.3 for stereo BTL application and Fig.4 for quad single-ended application unless otherwise specified PARAMETER Stereo BTL application Output power Output power at VP = 13.2 V Total harmonic distortion Power bandwidth THD = 0.5% THD = 10% THD = 0.5% THD = 10% Po = 1 W THD = 0.5% Po = -1 dB w.r.t. 15 W Low frequency roll-off High frequency roll-off Closed loop voltage gain Supply voltage ripple rejection ON mute stand-by Input impedance Noise output voltage (RMS value) ON ON mute Channel separation Channel unbalance RS = 0 ; note 5 RS = 10 k; note 5 notes 5 and 6 RS = 10 k Vno(rms) Vno(rms) Vno(rms) |Gv| - - - 40 - 70 100 60 - - - 200 - - 1 V V V dB dB note 4 RR RR RR |Zi| 48 48 80 25 - - - 30 - - - 38 dB dB dB k note 3 -1 dB -1 dB fL fH Gv - 20 25 45 - 26 - - 27 Hz kHz dB Bw - 20 to 15 000 - Hz Po Po Po Po THD 15 20 - - - 17 22 12 17 0.1 - - - - - W W W W % CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
May 1992
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Philips Semiconductors
Product specification
4 x 11 W single-ended or 2 x 22 W power amplifier
PARAMETER Quad single-ended application Output power note 7 THD = 0.5% THD = 10% Output power at RL = 2 W note 7 THD = 0.5% THD = 10% Total harmonic distortion Low frequency roll-off Po = 1 W note 3 -3 dB High frequency roll-off Closed loop voltage gain Supply voltage ripple rejection ON mute stand-by Input impedance Noise output voltage (RMS value) ON ON mute Channel separation Channel unbalance Notes to the characteristics 1. The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V. 2. At 18 V < VP < 30 V the DC output voltage VP/2. 3. Frequency response externally fixed. RS = 0 ; note 5 RS = 10 k; note 5 notes 5 and 6 RS = 10 k Vno(rms) Vno(rms) Vno(rms) |Gv| - - - 40 - 50 70 50 - - - note 4 RR RR RR |Zi| 48 48 80 50 - - - 60 - - - 75 -1 dB fL fH Gv - 20 19 45 - 20 - - 21 Po Po THD 7.5 10 - 8.5 11 0.1 - - - Po Po 4 5.5 5 6 - - CONDITIONS SYMBOL MIN. TYP.
TDA1554Q
MAX.
UNIT
W W W W % Hz kHz dB dB dB dB k
V V V dB dB
100 - - 1
4. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V) and a frequency between 100 Hz and 10 kHz. 5. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 6. Noise output voltage independent of RS (VI = 0 V). 7. Output power is measured directly at the output pins of the IC.
May 1992
7
Philips Semiconductors
Product specification
4 x 11 W single-ended or 2 x 22 W power amplifier
APPLICATION INFORMATION
TDA1554Q
Fig.3 Stereo BTL application circuit diagram.
May 1992
8
Philips Semiconductors
Product specification
4 x 11 W single-ended or 2 x 22 W power amplifier
TDA1554Q
Fig.4 Quad single-ended application circuit diagram.
May 1992
9
Philips Semiconductors
Product specification
4 x 11 W single-ended or 2 x 22 W power amplifier
PACKAGE OUTLINE DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
TDA1554Q
SOT243-1
non-concave D x Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c vM
1 Z e e1 bp wM
17 m e2
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.4 x 0.03 Z (1) 2.00 1.45
1.27 5.08
ISSUE DATE 95-03-11 97-12-16
May 1992
10
Philips Semiconductors
Product specification
4 x 11 W single-ended or 2 x 22 W power amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA1554Q
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
May 1992
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